US 12,032,744 B2
Integrated haptic system
Harsha Rao, Austin, TX (US); Rong Hu, San Jose, CA (US); Carl Lennart Ståhl, Svedala (SE); Jie Su, Shanghai (CN); Vadim Konradi, Austin, TX (US); Teemu Ramo, Edinburgh (GB); and Anthony Stephen Doy, Bend, OR (US)
Assigned to Cirrus Logic Inc., Austin, TX (US)
Filed by Cirrus Logic International Semiconductor Ltd., Edinburgh (GB)
Filed on Jan. 9, 2023, as Appl. No. 18/094,680.
Application 16/871,832 is a division of application No. 15/722,128, filed on Oct. 2, 2017, granted, now 10,732,714, issued on Aug. 4, 2020.
Application 18/094,680 is a continuation of application No. 16/871,832, filed on May 11, 2020, abandoned.
Claims priority of provisional application 62/540,921, filed on Aug. 3, 2017.
Claims priority of provisional application 62/503,163, filed on May 8, 2017.
Prior Publication US 2023/0161413 A1, May 25, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 3/01 (2006.01); G06F 3/041 (2006.01); G06F 3/044 (2006.01)
CPC G06F 3/016 (2013.01) [G06F 3/01 (2013.01); G06F 3/0414 (2013.01); G06F 3/0416 (2013.01); G06F 3/044 (2013.01)] 30 Claims
OG exemplary drawing
 
1. An integrated haptic system comprising:
a digital signal processor configured to:
receive an input signal indicative of a force applied to a force sensor; and
generate a haptic playback signal responsive to the input signal; and
an amplifier communicatively coupled to the digital signal processor, integrated with the digital signal processor into the integrated haptic system, and configured to amplify the haptic playback signal and drive a vibrational actuator communicatively coupled to the amplifier with the haptic playback signal as amplified by the amplifier;
wherein the digital signal processor is further configured to:
communicate an activity notification to a communicatively coupled applications processor while the haptic playback signal is being generated;
receive communications from the applications processor; and
modify the haptic playback signal responsive to the communications.