US 12,032,742 B2
Haptic button with shape memory alloy (SMA)
Peter Van Wyk, Cambridge (GB); Andreas Flouris, Cambridge (GB); Joshua Carr, Cambridge (GB); and Marc-Sebastian Scholz, Cambridge (GB)
Assigned to CAMBRIDGE MECHATRONICS LIMITED, Cambridge (GB)
Appl. No. 17/290,378
Filed by CAMBRIDGE MECHATRONICS LIMITED, Cambridge (GB)
PCT Filed Nov. 4, 2019, PCT No. PCT/EP2019/080141
§ 371(c)(1), (2) Date Apr. 30, 2021,
PCT Pub. No. WO2020/089490, PCT Pub. Date May 7, 2020.
Claims priority of application No. 1817980 (GB), filed on Nov. 2, 2018.
Prior Publication US 2021/0405754 A1, Dec. 30, 2021
Int. Cl. G06F 3/01 (2006.01); H01H 3/12 (2006.01); H01H 13/85 (2006.01); H01H 3/00 (2006.01)
CPC G06F 3/016 (2013.01) [H01H 3/12 (2013.01); H01H 2003/008 (2013.01); H01H 2215/05 (2013.01); H01H 2221/064 (2013.01); H01H 2223/002 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A standalone shape memory alloy (SMA) actuator module for incorporation in a casing of an electronic device and for providing haptic feedback via a button of the electronic device, the actuator module comprising:
a housing;
an actuator housed within the housing, wherein the actuator comprises:
a static part;
a moveable part that is moveable with respect to the static part;
at least one SMA wire configured, on contraction, to move the moveable part relative to the static part; and
a restoring element configured to restore the moveable part to its original position; and
at least one resilient element configured to bring the actuator module into contact with the button and the casing of the electronic device when the actuator module is mounted within the electronic device,
wherein the at least one resilient element is configured to deform, thereby transferring force to the casing of the electronic device, in response to a force applied to the button that exceeds a predetermined maximum force.