US 12,032,511 B2
Synchronization in multi-chip systems
Michial Allen Gunter, Oakland, CA (US); Denis Baylor, Cupertino, CA (US); Clifford Biffle, Berkeley, CA (US); and Charles Ross, Mountain View, CA (US)
Assigned to Google LLC, Mountain View, CA (US)
Filed by Google LLC, Mountain View, CA (US)
Filed on Jun. 21, 2022, as Appl. No. 17/844,888.
Application 17/844,888 is a continuation of application No. 17/346,058, filed on Jun. 11, 2021, granted, now 11,372,801.
Application 17/346,058 is a continuation of application No. PCT/US2020/046405, filed on Aug. 14, 2020.
Claims priority of provisional application 62/887,783, filed on Aug. 16, 2019.
Prior Publication US 2022/0391347 A1, Dec. 8, 2022
Int. Cl. G06F 15/173 (2006.01); G06F 15/17 (2006.01); G06N 3/063 (2023.01); H04L 12/44 (2006.01); H04L 43/0864 (2022.01)
CPC G06F 15/17312 (2013.01) [G06F 15/17 (2013.01); G06F 15/17337 (2013.01); H04L 12/44 (2013.01); G06N 3/063 (2013.01); H04L 43/0864 (2013.01)] 14 Claims
OG exemplary drawing
 
1. An inter-chip timing synchronization method comprising:
for each pair of integrated circuit chips in a plurality of chips of a semiconductor device,
determining a first one-way latency for transmissions from a first integrated circuit chip in the pair to a second integrated circuit chip in the pair of integrated circuit chips, and
determining a second one-way latency for transmissions from the second integrated circuit chip in the pair to the first integrated circuit chip in the pair of integrated circuit chips;
receiving, at a semiconductor device driver, the first one-way latency and the second one-way latency for each pair of integrated circuit chips;
determining, by the semiconductor device driver and from the respective first one-way latency and the second one-way latency for each pair of integrated circuit chips, a loop latency between each pair of integrated circuit chips; and
adjusting, by the semiconductor device driver and for at least one pair of integrated circuit chips, a local counter of the second integrated circuit chip in the at least one pair of integrated circuit chips based on a characteristic inter-chip latency of the semiconductor device and the first one-way latency of the at least one pair of integrated circuit chips.