CPC G01S 7/4813 (2013.01) [G01S 7/4818 (2013.01); G01S 17/42 (2013.01); G01S 17/88 (2013.01)] | 16 Claims |
1. A chip-scale silicon-based hybrid-integrated LiDAR system, comprising
a transmitting end (Tx),
a receiving end (Rx), and
a backup receiving end (Bk),
wherein the transmitting end sequentially comprises a hybrid-integrated narrow-linewidth tunable laser module (101), a silicon-nitride-integrated beam splitter module (102), a silicon-integrated phase shifter array module (103) and a silicon-nitride-integrated unidirectional transmitting antenna array module (104) w.r.t the optical path;
the receiving end comprises a silicon-nitride-integrated unidirectional receiving antenna array module (201), a silicon-nitride-integrated beam splitter module (202) and a silicon-integrated coherent receiving module (203);
the backup receiving end sequentially comprises a spatial optical module (301) and an off-chip coherent receiving module (302) w.r.t the optical path;
the electric control of the hybrid-integrated narrow-linewidth tunable laser module (101) and the phase shifter of the silicon-integrated phase shifter array module (103) at the transmitting end and the signal processing of the silicon-integrated coherent receiving module (203) at the receiving end are implemented by a piggybacked high-speed integrated circuit module outside the photonic chip system on a ad-hoc basis.
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