US 12,032,000 B2
Test socket assemblies with liquid cooled frame for semiconductor integrated circuits
Quynh Ngoc Nguyen, Fremont, CA (US); and James Edward Spooner, Manteca, CA (US)
Assigned to SMITHS INTERCONNECT AMERICAS, INC., Kansas City, KS (US)
Filed by Smiths Interconnect Americas, Inc., Kansas City, KS (US)
Filed on Aug. 12, 2022, as Appl. No. 17/886,754.
Claims priority of provisional application 63/232,981, filed on Aug. 13, 2021.
Prior Publication US 2023/0047762 A1, Feb. 16, 2023
Int. Cl. G01R 31/28 (2006.01); G01R 1/04 (2006.01)
CPC G01R 1/0458 (2013.01) [G01R 31/2877 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A socket assembly for a semiconductor integrated circuit (IC) chip, comprising:
a socket frame including a metallic frame body defining an opening sized to receive the semiconductor IC chip, wherein the frame body includes one or more channels transversely positioned through the frame body and positioned in an interior of the frame body, the channels defining a fluid path; and
a socket cartridge including a metallic cartridge body defining a plurality of cavities each sized to receive a test probe therein, the socket frame covering a portion of the socket cartridge and exposing the plurality of cavities at the opening.