US 12,031,920 B2
Method for detecting coverage rate of intermetallic compound
Dingguo Zhong, Shandong (CN); Dewen Tian, Shandong (CN); and Qinglin Song, Shandong (CN)
Assigned to Weifang Goertek Microelectronics Co., Ltd., Shandong (CN)
Appl. No. 17/614,905
Filed by Weifang Goertek Microelectronics Co., Ltd., Shandong (CN)
PCT Filed Dec. 6, 2019, PCT No. PCT/CN2019/123556
§ 371(c)(1), (2) Date Nov. 29, 2021,
PCT Pub. No. WO2020/238138, PCT Pub. Date Dec. 3, 2020.
Claims priority of application No. 201910455864.5 (CN), filed on May 28, 2019.
Prior Publication US 2022/0236195 A1, Jul. 28, 2022
Int. Cl. G01N 21/84 (2006.01); G01N 1/32 (2006.01); G01N 21/95 (2006.01)
CPC G01N 21/9501 (2013.01) [G01N 1/32 (2013.01); G01N 2021/8433 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A method for detecting a coverage rate of an intermetallic compound, comprising:
putting a chip subjected to wire bonding into a mixed reagent of fuming nitric acid and fuming sulfuric acid for soaking, wherein the chip subjected to wire bonding comprises a silver wire and an aluminum pad;
taking out the chip after the silver wire is removed; and
detecting the coverage rate of an intermetallic compound on the aluminum pad.