US 12,031,847 B2
Sensor device and electronic apparatus
Masayasu Sakuma, Kamiina (JP); Yoshihiro Kobayashi, Komagane (JP); Shojiro Kitamura, Suwa (JP); and Taketo Chino, Hokuto (JP)
Assigned to SEIKO EPSON CORPORATION, (JP)
Filed by SEIKO EPSON CORPORATION, Tokyo (JP)
Filed on Apr. 26, 2023, as Appl. No. 18/307,274.
Application 17/395,519 is a division of application No. 16/743,517, filed on Jan. 15, 2020, granted, now 11,215,484, issued on Jan. 4, 2022.
Application 16/135,510 is a division of application No. 14/596,853, filed on Jan. 14, 2015, granted, now 10,107,653, issued on Oct. 23, 2018.
Application 14/596,853 is a division of application No. 13/545,075, filed on Jul. 10, 2012, granted, now 8,960,000, issued on Feb. 24, 2015.
Application 18/307,274 is a continuation of application No. 17/395,519, filed on Aug. 6, 2021, granted, now 11,709,079.
Application 16/743,517 is a continuation of application No. 16/135,510, filed on Sep. 19, 2018, granted, now 10,612,948, issued on Apr. 7, 2020.
Claims priority of application No. 2011-154502 (JP), filed on Jul. 13, 2011.
Prior Publication US 2023/0258481 A1, Aug. 17, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G01D 11/24 (2006.01); G01C 19/5769 (2012.01); G01C 21/16 (2006.01); H01R 12/72 (2011.01); H05K 1/14 (2006.01); G01D 11/30 (2006.01)
CPC G01D 11/245 (2013.01) [G01C 19/5769 (2013.01); G01C 21/166 (2020.08); H01R 12/72 (2013.01); H05K 1/148 (2013.01); G01D 11/30 (2013.01); H05K 2201/09163 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A sensor device comprising:
a first rigid board having a first mounting surface;
a first sensor mounted on the first mounting surface;
a second rigid board having a second mounting surface;
a second sensor mounted on the second mounting surface;
a third rigid board having a third mounting surface and a fourth mounting surface opposite the third mounting surface;
a third sensor mounted on the third mounting surface;
a microcontroller mounted on the fourth mounting surface; and
a casing having:
a first fixation surface extending along a first direction and a second direction perpendicular to the first direction;
a second fixation surface extending along the first direction and a third direction perpendicular to the first and second directions; and
a third fixation surface extending along the second direction and the third direction,
wherein the first rigid board is fixed to the first fixation surface of the casing,
the second rigid board is fixed to the second fixation surface of the casing,
the third rigid board is fixed to the third fixation surface of the casing, and
the third rigid board has a ground layer disposed between the third sensor and the microcontroller.