US 12,031,064 B2
Structural adhesive compositions
Umesh C. Desai, Wailuku, HI (US); Tien-Chieh Chao, Mars, PA (US); Masayuki Nakajima, Wexford, PA (US); and Kaliappa G. Ragunathan, Waxhaw, NC (US)
Assigned to PPG Industries Ohio, Inc., Cleveland, OH (US)
Filed by PPG Industries Ohio, Inc., Cleveland, OH (US)
Filed on Mar. 17, 2022, as Appl. No. 17/697,727.
Application 17/198,504 is a division of application No. 14/961,513, filed on Dec. 7, 2015, granted, now 10,947,428, issued on Feb. 24, 2021.
Application 17/697,727 is a continuation of application No. 17/198,504, filed on Mar. 11, 2021, granted, now 11,629,276.
Application 14/961,513 is a continuation of application No. 13/918,021, filed on Jun. 14, 2013, abandoned.
Application 13/918,021 is a continuation in part of application No. 13/315,518, filed on Dec. 9, 2011, abandoned.
Application 13/315,518 is a continuation in part of application No. 12/949,878, filed on Nov. 19, 2010, abandoned.
Prior Publication US 2022/0213362 A1, Jul. 7, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. C09J 163/00 (2006.01); B32B 27/38 (2006.01); B82Y 30/00 (2011.01); C08G 59/06 (2006.01); C08G 59/18 (2006.01); C08G 59/20 (2006.01); C08G 59/40 (2006.01); C08G 59/42 (2006.01); C08G 59/50 (2006.01); C08G 59/56 (2006.01); C08L 63/00 (2006.01); C09J 5/00 (2006.01); C09J 5/06 (2006.01); C08K 3/04 (2006.01)
CPC C09J 163/00 (2013.01) [B82Y 30/00 (2013.01); C08G 59/066 (2013.01); C08G 59/182 (2013.01); C08G 59/184 (2013.01); C08G 59/4276 (2013.01); C08G 59/5006 (2013.01); C08L 63/00 (2013.01); C09J 5/00 (2013.01); C09J 5/06 (2013.01); C08K 3/04 (2013.01); C08L 2205/02 (2013.01); C09J 2463/00 (2013.01)] 28 Claims
 
1. A one-component composition comprising:
(a) an epoxy-capped flexibilizer comprising a reaction product of reactants comprising (i) a first epoxy compound, (ii) a polyol, and (iii) a diacid;
(b) a heat-activated latent curing agent comprising (x) a reaction product of reactants comprising (i) a second epoxy compound and (ii) an amine, an alkaloid, or combinations thereof, and (y) dicyandiamide having a D98 of 6 μm;
(c) an optional epoxy/CTBN adduct;
(d) an epoxy/dimer acid adduct;
(e) rubber particles having a core/shell structure;
(f) optional graphenic carbon particles; and
an epoxy compound or an epoxy resin not incorporated into or reacted as a part of any of the components (a)-(f) and/or an epoxy carrier resin incorporated into the component (e).
 
21. A method of treating a substrate, comprising:
applying the composition of claim 1 to a surface of the substrate.
 
22. The method of claim 21, further comprising heating the composition at a temperature of 120° C. to 140° C.