	US 12,031,019 B2
	High strength and high thermal conductivity polyethylene thin film having a bimodal molecular weight
Sheng Ye, Redmond, WA (US); Andrew John Ouderkirk, Kirkland, WA (US); Arman Boromand, Issaquah, WA (US); Christopher Stipe, Woodinville, WA (US); Hao Mei, Redmond, WA (US); and Christopher Yuan Ting Liao, Seattle, WA (US)
Assigned to Meta Platforms Technologies, LLC, Menlo Park, CA (US)
Filed by META PLATFORMS TECHNOLOGIES, LLC, Menlo Park, CA (US)
Filed on Dec. 17, 2021, as Appl. No. 17/554,982.
Claims priority of provisional application 63/271,314, filed on Oct. 25, 2021.
Claims priority of provisional application 63/183,152, filed on May 3, 2021.
Prior Publication US 2022/0348747 A1, Nov. 3, 2022
Int. Cl. C08L 23/06 (2006.01); C08K 3/014 (2018.01); C08K 5/01 (2006.01)

CPC C08L 23/06 (2013.01) [C08K 3/014 (2018.01); C08K 5/01 (2013.01); C08L 2207/066 (2013.01)]

10 Claims

1. A polyethylene layer, comprising:

a crystalline polymer and an additive, wherein the crystalline polymer has a weight average molecular weight of at least approximately 100,000 g/mol and is oriented either uniaxially or biaxially, and the additive comprises a polyethylene oligomer having a reactive moiety selected from the group consisting of vinyl, acrylate, methacrylate, epoxy, isocyanate, hydroxyl, and amine, and has a weight average molecular weight of less than approximately 4,000 g/mol.