US 12,030,230 B2
Resin-sealed electronic component and method for manufacturing the same
Yiming Jin, Tokyo (JP); and Akitoshi Fujimori, Tokyo (JP)
Assigned to Proterial, Ltd., Tokyo (JP)
Filed by Hitachi Metals, Ltd., Tokyo (JP)
Filed on Nov. 2, 2021, as Appl. No. 17/517,389.
Claims priority of application No. 2020-184409 (JP), filed on Nov. 4, 2020.
Prior Publication US 2022/0134618 A1, May 5, 2022
Int. Cl. B29C 45/14 (2006.01); G01L 3/10 (2006.01); B29L 31/34 (2006.01)
CPC B29C 45/14836 (2013.01) [B29C 45/14467 (2013.01); B29C 45/14639 (2013.01); G01L 3/105 (2013.01); B29L 2031/3481 (2013.01)] 5 Claims
OG exemplary drawing
 
1. A torque sensor comprising a resin-sealed electronic component, comprising:
an electronic component main body sealed with a resin housing having an annular shape,
wherein the resin housing comprises a pair of resin members aligned in a first direction with sandwiching a housing space housing the electronic component main body, and a sealing member comprising a molding resin and being molded so as to cover at least a portion of each of the pair of resin members,
wherein a portion of one resin member of the pair of resin members and a portion of the other resin member are aligned in a second direction intersecting the first direction to constitute a suppression structure that suppresses the molding resin from entering the housing space, and
wherein the electronic component comprises a plurality of flexible substrates.