US 12,030,224 B2
High dynamic temperature control system
Martin Wallinger, Abtenau (AT); Gerhard Schefbänker, Scheffau am Tennengebirge (AT); Wolfgang Pöschl, Abtenau (AT); Gernot Antosch, Hallein (AT); Reinhardt Lehnert, Ubstadt-Weiher (DE); Michael Kübler, Untergruppenbach-Oberheinriet (DE); and August Burr, Bretzfeld (DE)
Assigned to Watlow Electric Manufacturing Company, St. Louis, MO (US)
Filed by WATLOW ELECTRIC MANUFACTURING COMPANY, St. Louis, MO (US)
Filed on Feb. 28, 2022, as Appl. No. 17/682,622.
Application 17/682,622 is a continuation of application No. 13/629,999, filed on Sep. 28, 2012, abandoned.
Claims priority of provisional application 61/540,704, filed on Sep. 29, 2011.
Prior Publication US 2022/0266478 A1, Aug. 25, 2022
Int. Cl. B29C 33/02 (2006.01); H05B 3/28 (2006.01); B29C 45/26 (2006.01); B29C 45/27 (2006.01); B29C 45/73 (2006.01)
CPC B29C 33/02 (2013.01) [H05B 3/28 (2013.01); B29C 45/2642 (2013.01); B29C 2045/2746 (2013.01); B29C 45/7312 (2013.01); H05B 2203/003 (2013.01)] 21 Claims
OG exemplary drawing
 
1. A molding system comprising:
at least one mold part defining a mold cavity having an opening;
a heating and cooling module inserted into the opening to close the opening of the mold cavity, the heating and cooling module comprising
a die insert defining a mold surface to be in contact with a molten material received in the mold cavity,
a layered heater for heating the mold surface, and
a cooling unit for cooling the mold surface,
wherein an entire area of the mold surface is disposed inside the mold cavity defined by the at least one mold part, such that the mold surface is being in contact with the at least one mold part and an entire portion of the die insert is surrounded by the at least one mold part when the opening of the mold cavity is closed by the heating and cooling module, the entire portion of the die insert being higher than any other part of the heating and cooling module, spaced apart from a top surface of the cooling unit and not in contact with the cooling unit,
wherein the layered heater is disposed between the die insert and the cooling unit and includes functional layers formed directly on a surface of the cooling unit or a surface of the die insert opposite to the mold surface by using layered or layering processes selected from a group consisting of thick film, thin film, thermal spray and sol-gel processes.