| CPC B24B 37/042 (2013.01) | 2 Claims |
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1. A processing method of polishing a workpiece having a circular surface to be polished using a polishing pad having a circular polishing surface, the processing method comprising:
a holding step of holding the workpiece on a chuck table having a conical holding surface having a protruding center;
an adjusting step of adjusting an angle formed between a rotational axis of the chuck table and a rotational axis of the polishing pad in order to make a line segment interconnecting a point on an outer circumferential edge of the holding surface, whose distance to the polishing surface in a direction perpendicular thereto is the shortest, and a center of the holding surface, parallel to the polishing surface;
a positioning step of moving the polishing pad and the chuck table horizontally relatively to each other to position the polishing pad above the chuck table such that first coordinates at which a point on an outer circumferential edge of the surface to be polished in alignment with the line segment is positioned do not overlap the polishing pad and second coordinates at which a center of the surface to be polished is positioned overlap the polishing pad in a coordinate plane parallel to the polishing surface; and
a polishing step of polishing the workpiece by keeping the point on the outer circumferential edge of the surface to be polished at the first coordinates out of contact with the polishing surface and keeping a point on the outer circumferential edge of the surface to be polished at third coordinates on the coordinate plane that are different from the first coordinates in contact with an outer circumferential edge of the polishing surface while the polishing pad and the chuck table are being rotated about respective rotational axes thereof.
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