US 12,030,143 B2
Method for manufacturing a cutting tool, and the cutting tool
Naoki Watanobe, Hyogo (JP); Gaku Harada, Hyogo (JP); and Satoru Kukino, Hyogo (JP)
Assigned to SUMITOMO ELECTRIC HARDMETAL CORP., Hyogo (JP)
Appl. No. 17/630,054
Filed by SUMITOMO ELECTRIC HARDMETAL CORP., Hyogo (JP)
PCT Filed Jul. 1, 2020, PCT No. PCT/JP2020/025745
§ 371(c)(1), (2) Date Jan. 25, 2022,
PCT Pub. No. WO2021/020007, PCT Pub. Date Feb. 4, 2021.
Claims priority of application No. 2019-142400 (JP), filed on Aug. 1, 2019.
Prior Publication US 2022/0266400 A1, Aug. 25, 2022
Int. Cl. B23P 15/28 (2006.01); B23B 27/20 (2006.01); B23K 26/361 (2014.01)
CPC B23P 15/28 (2013.01) [B23B 27/20 (2013.01); B23K 26/361 (2015.10)] 1 Claim
OG exemplary drawing
 
1. A cutting tool having a rake face, a flank face, and an edge having a ridge line interconnecting the rake face and the flank face, wherein on the flank face there is a cutting edge region from the ridge line of the edge to a point away therefrom on the side of the flank face by a distance X,
the distance X being 0.2 mm or more and 5 mm or less,
the cutting edge region having a surface roughness, as represented by an arithmetic mean roughness Ra, of 0.2 μm or less,
the edge having the ridge line without recesses therein of 5 μm or more in size, wherein
a ridge of the edge having the ridge line has a radius of curvature of 1 μm or less,
the material of the cutting tool is nano-polycrystalline diamond, single-crystal diamond, or binderless cBN, and
the cutting edge region on the flank face has no feed marks thereon when observed in multiple fields of view thereon with a laser microscope at a magnification of 10 times the cutting edge region on the flank face.