	US 12,030,140 B2
	Lead-free solder alloy and method of manufacturing electronic device using the same
Young Woo Lee, Gyeonggi-do (CN); Seul Gi Lee, Yongin-si (KR); Hui Joong Kim, Yongin-si (KR); Jae Yool Son, Yongin-si (KR); Jae Hun Song, Yongin-si (KR); and Jeong Tak Moon, Suwon-si (KR)
Assigned to MK ELECTRON CO., LTD., (KR)
Filed by MK ELECTRON CO., LTD., Yongin-si (KR)
Filed on Oct. 4, 2022, as Appl. No. 17/959,502.
Claims priority of application No. 10-2021-0133446 (KR), filed on Oct. 7, 2021.
Prior Publication US 2023/0111798 A1, Apr. 13, 2023
Int. Cl. B23K 35/26 (2006.01); C22C 12/00 (2006.01); C22C 13/02 (2006.01); B23K 20/00 (2006.01); B23K 101/36 (2006.01)

CPC B23K 35/264 (2013.01) [B23K 35/262 (2013.01); C22C 12/00 (2013.01); C22C 13/02 (2013.01); B23K 20/00 (2013.01); B23K 2101/36 (2018.08)]

7 Claims

1. A lead-free solder alloy, consisting of:

bismuth (Bi), content of which is equal to or greater than 56 wt % and equal to or less than 57.5 wt %;

indium (In), content of which is equal to or greater than 0.05 wt % and equal to or less than 1.0 wt %;

gallium (Ga) and at least one selected from germanium (Ge) and phosphorus (P), wherein total content of the gallium and the at least one selected from germanium and phosphorus is equal to or greater than 5 ppm and equal to or less than 500 ppm by weight; and

a remaining balance consisting of tin (Sn) and any other unavoidable impurity,

wherein the lead-free solder alloy does not have silver (Ag), and does not have copper (Cu).