US 12,030,093 B2
Steam treatment stations for chemical mechanical polishing system
Haosheng Wu, San Jose, CA (US); Jianshe Tang, San Jose, CA (US); Hari Soundararajan, Sunnyvale, CA (US); Shou-Sung Chang, Mountain View, CA (US); Hui Chen, San Jose, CA (US); Chih Chung Chou, San Jose, CA (US); Alexander John Fisher, Santa Clara, CA (US); and Paul D. Butterfield, San Jose, CA (US)
Assigned to Applied Materials, Inc., Santa Clara, CA (US)
Filed by Applied Materials, Inc., Santa Clara, CA (US)
Filed on Aug. 16, 2022, as Appl. No. 17/889,330.
Application 17/889,330 is a division of application No. 16/886,571, filed on May 28, 2020, granted, now 11,446,711.
Claims priority of provisional application 62/854,305, filed on May 29, 2019.
Prior Publication US 2022/0388041 A1, Dec. 8, 2022
Int. Cl. B08B 3/10 (2006.01); B24B 37/34 (2012.01); H01L 21/67 (2006.01)
CPC B08B 3/106 (2013.01) [B24B 37/34 (2013.01); H01L 21/67051 (2013.01); H01L 21/67248 (2013.01); B08B 2203/007 (2013.01)] 15 Claims
OG exemplary drawing
 
1. An apparatus for steam treatment of a conditioner head and/or conditioner disk in a chemical mechanical polishing system, comprising:
a cleaning cup having a cavity that is open at top and that is sized and positioned to receive the conditioner head of the chemical mechanical polishing system;
a boiler to generate steam;
one or more nozzles positioned to direct steam inwardly into the cavity defined by the cleaning cup and onto the conditioner head and/or the conditioner disk held by the conditioner head when positioned in the cleaning cup; and
a supply line running from the boiler to the one or more nozzles to supply steam to the one or more nozzles.