US 12,029,546 B2
Implantable sensor enclosure with thin sidewalls
Harry Rowland, Plainfield, IL (US); and Michael Nagy, Lombard, IL (US)
Assigned to ENDOTRONIX, INC., Lisle, IL (US)
Filed by ENDOTRONIX, INC., Lisle, IL (US)
Filed on Jan. 9, 2023, as Appl. No. 18/094,537.
Application 18/094,537 is a continuation of application No. 16/594,155, filed on Oct. 7, 2019, granted, now 11,547,320.
Application 16/594,155 is a continuation of application No. 15/837,075, filed on Dec. 11, 2017, granted, now 10,433,764, issued on Oct. 8, 2019.
Application 15/837,075 is a continuation of application No. 14/129,725, granted, now 9,867,552, issued on Jan. 16, 2018, previously published as PCT/US2012/044998, filed on Jun. 29, 2012.
Claims priority of provisional application 61/502,982, filed on Jun. 30, 2011.
Prior Publication US 2023/0371842 A1, Nov. 23, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. A61B 5/02 (2006.01); A61B 5/00 (2006.01); A61B 5/0215 (2006.01); A61B 5/07 (2006.01)
CPC A61B 5/076 (2013.01) [A61B 5/0215 (2013.01); A61B 5/6861 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An implant comprising:
a housing comprising side walls that define a cuboid, wherein said housing has a length, a width and a height, and wherein the length is greater than the width and the height, and wherein the housing comprises two opposite sides the sides each comprising an opening;
electronics comprising an antenna coil positioned in said housing; and
end walls bonded to the two opposite sides of the housing enclosing the openings, wherein said end walls are thinner than the side walls.