US 11,700,719 B2
Nonuniform air grid
Johannes Steffens, Munich (DE); Josef Koeppl, Munich (DE); Martin Kappels, Munich (DE); Stefan Dannerbauer, Munich (DE); and Stefan Aman, Munich (DE)
Assigned to Rohde & Schwarz GmbH & Co. KG, Munich (DE)
Filed by Rohde & Schwarz GmbH & Co. KG, Munich (DE)
Filed on Aug. 17, 2022, as Appl. No. 17/820,484.
Claims priority of application No. 21193283 (EP), filed on Aug. 26, 2021.
Prior Publication US 2023/0060180 A1, Mar. 2, 2023
Int. Cl. H05K 9/00 (2006.01)
CPC H05K 9/0086 (2013.01) [H05K 9/0041 (2013.01); H05K 9/0088 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A housing wall for a housing of an electric or electronic device, the housing wall comprising:
at least one air grid having at least a first layer with a first mesh structure and a second layer with a second mesh structure,
wherein the first mesh structure and the second mesh structure at least partially comprise an electrically conductive material,
wherein the first mesh structure is coextensively arranged with the second mesh structure,
wherein the first layer and the second layer are electrically conductively coupled,
wherein the first mesh structure comprises a first plurality of through-holes, wherein the second mesh structure comprises a second plurality of through-holes,
wherein the through-holes of the first plurality of through-holes are misaligned compared to through-holes of the second plurality of through-holes such that a nonuniform total through-hole configuration of the air grid is provided, wherein the total through-hole configuration is irregular,
wherein the housing wall provides an electrical shielding for electromagnetic waves having a frequency of 1 GHz or more,
wherein the first mesh structure comprises a pattern of through-holes having a first shape,
wherein the second mesh structure comprises a pattern of through-holes having a second shape, wherein the first shape and the second shape are the same, and
wherein the second mesh structure comprises a through-hole pattern which represents a non-integer multiple of a through-hole pattern of the first mesh structure.