CPC H05K 7/20927 (2013.01) [H02J 7/0042 (2013.01); H02M 7/003 (2013.01); H05K 7/1432 (2013.01); H05K 2201/10272 (2013.01)] | 9 Claims |
8. An electronic board comprising:
a cooling circuit,
an insulated metal substrate, wherein said insulated metal substrate is directly connected with the cooling circuit,
a layer of electrically insulating material made on at least one portion of said insulated metal substrate,
at least one electronic circuit made on said layer of electrically insulating material, and
at least one conductive metal bar for the transport and the distribution of current, electrically connected to said electronic circuit and provided with at least one portion arranged in direct contact with at least one surface portion of said electronic board, for the cooling of said conductive metal bar by means of said cooling circuit, wherein
said conductive metal bar is provided with a lower surface arranged in direct contact with at least one surface portion of said electronic board,
said conductive metal bar comprises an upper surface opposite said lower surface associated with said electronic board, and
said conductive metal bar extends over at least one portion of said electronic board, on said layer of electrically insulating material.
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