CPC H05K 3/46 (2013.01) [H01P 3/08 (2013.01); H01Q 1/38 (2013.01); H01Q 13/08 (2013.01); H05K 1/09 (2013.01); H05K 3/38 (2013.01)] | 16 Claims |
1. A multilayer substrate, comprising:
a multilayer body including a plurality of dielectric layers being layered;
a wire conductor in the multilayer body and through which a radio frequency signal passes;
a first ground electrode in or on the multilayer body and that includes a first surface facing a first main surface of the wire conductor; and
a second ground electrode that is in or on the multilayer body and that includes a second surface facing the first surface of the first ground electrode, wherein
the first surface includes a first region and a second region,
a surface roughness of the first region is lower than a surface roughness of the second region,
the first region overlaps at least part of the first main surface of the wire conductor in plan view in a direction normal to the first surface of the first ground electrode,
the wire conductor is between the first ground electrode and the second ground electrode,
the second surface includes a third region and a fourth region,
a surface roughness of the third region is lower than a surface roughness of the fourth region, and
the third region overlaps at least part of the first main surface of the wire conductor in plan view in the direction normal to the first surface of the first ground electrode.
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