US 11,700,685 B2
Method for manufacturing the same
Fu-Yun Shen, Shenzhen (CN); and Xian-Qin Hu, Shenzhen (CN)
Assigned to Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN); and QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an (CN)
Filed by Avary Holding (Shenzhen) Co., Limited., Shenzhen (CN); and QING DING PRECISION ELECTRONICS (HUAIAN) CO., LTD, Huai an (CN)
Filed on Oct. 28, 2021, as Appl. No. 17/512,901.
Application 17/512,901 is a division of application No. 17/029,355, filed on Sep. 23, 2020, granted, now 11,197,368.
Claims priority of application No. 202010494280.1 (CN), filed on Jun. 3, 2020.
Prior Publication US 2022/0053629 A1, Feb. 17, 2022
Int. Cl. H05K 1/09 (2006.01); H05K 3/06 (2006.01); H01L 23/13 (2006.01); H05K 1/02 (2006.01); H05K 3/46 (2006.01)
CPC H05K 1/024 (2013.01) [H05K 1/0219 (2013.01); H05K 3/4602 (2013.01); H05K 3/4655 (2013.01); H05K 2201/0723 (2013.01); H05K 2201/09063 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A method for manufacturing a high-frequency circuit board comprising:
providing an inner circuit board including a first substrate layer and a first conductor layer on a surface of the first substrate layer, the first conductor layer including a signal line and two ground lines arranged at intervals on both sides of the signal line, the first substrate layer having a plurality of first through holes corresponding to the signal line;
providing two copper clad laminates, each of the two copper clad laminates comprising a second substrate layer and a copper foil on a surface of the second substrate layer, the second substrate layer having a plurality of second through holes;
pressing the two copper clad laminates on two sides of the inner circuit board, the second substrate layer abutting the inner circuit board, and the second through holes non-aligned with the first through holes; and
forming a second conductor layer from the copper foil.