US 11,700,471 B2
Headphones with an anti-buckling assembly
Edward Siahaan, San Francisco, CA (US); Daniel R. Bloom, Alameda, CA (US); Jason J. LeBlanc, Castro Valley, CA (US); and Phillip Qian, Tokyo (JP)
Assigned to APPLE INC., Cupertino, CA (US)
Filed by Apple Inc., Cupertino, CA (US)
Filed on May 26, 2022, as Appl. No. 17/804,274.
Application 17/804,274 is a continuation of application No. 16/878,565, filed on May 19, 2020, granted, now 11,375,306.
Application 16/878,565 is a continuation of application No. PCT/US2018/062143, filed on Nov. 20, 2018.
Claims priority of provisional application 62/588,801, filed on Nov. 20, 2017.
Prior Publication US 2022/0386009 A1, Dec. 1, 2022
Int. Cl. H04R 25/00 (2006.01); H04R 1/10 (2006.01); H04R 5/033 (2006.01); H04R 5/04 (2006.01); G10K 11/178 (2006.01)
CPC H04R 1/1008 (2013.01) [H04R 1/105 (2013.01); H04R 1/1033 (2013.01); H04R 1/1041 (2013.01); H04R 1/1066 (2013.01); H04R 1/1075 (2013.01); H04R 1/1083 (2013.01); H04R 5/0335 (2013.01); H04R 5/04 (2013.01); G10K 11/17861 (2018.01); G10K 11/17873 (2018.01)] 20 Claims
OG exemplary drawing
 
1. Headphones, comprising:
first and second earpieces; and
a headband assembly joining the first earpiece to the second earpiece, the headband assembly comprising a rigid cable coupled to the first earpiece and a signal cable having at least a portion arranged in a helical geometry around the rigid cable and electrically coupled to the first earpiece.