CPC H01R 13/2457 (2013.01) [G01R 31/2601 (2013.01); H01L 22/34 (2013.01); H05K 1/181 (2013.01); H05K 2201/10409 (2013.01)] | 10 Claims |
1. A wafer testing assembly, comprising:
a signal transmission board configured to be connected to a probe head, wherein the signal transmission board includes a plurality of connection pads;
a testing circuit board configured to be electrically coupled to a testing apparatus, wherein the testing circuit board includes a plurality of metal pads spaced apart from each other; and
a board-like connector sandwiched between the signal transmission board and the testing circuit board, wherein the board-like connector includes:
a plurality of dual-arm bridges spaced apart from each other, wherein each of the dual-arm bridges includes:
a carrier;
a first cantilever and a second cantilever both extending from inner lateral walls of the carrier and both being coplanar with the carrier;
a first abutting column extending from the first cantilever along a first direction; and
a second abutting column extending from the second cantilever along a second direction that is opposite to the first direction; and
an insulating layer connecting the carriers of the dual-arm bridges, wherein the first abutting column and the second abutting column of each of the dual-arm bridges respectively protrude from two opposite sides of the insulating layer;
wherein the first abutting columns of the dual-arm bridges respectively abut against the connection pads of the signal transmission board, and the second abutting columns of the dual-arm bridges respectively abut against the metal pads of the testing circuit board;
wherein the signal transmission board and the testing circuit board are electrically coupled to each other through the board-like connector.
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