US 11,699,759 B2
Integrated circuit devices and methods of manufacturing the same
Seungmin Song, Hwaseong-si (KR); Junbeom Park, Seoul (KR); Bongseok Suh, Seoul (KR); and Junggil Yang, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Dec. 8, 2021, as Appl. No. 17/545,072.
Application 17/545,072 is a continuation of application No. 16/743,206, filed on Jan. 15, 2020, granted, now 11,227,952.
Claims priority of application No. 10-2019-0062057 (KR), filed on May 27, 2019.
Prior Publication US 2022/0093786 A1, Mar. 24, 2022
Int. Cl. H01L 29/78 (2006.01); H01L 29/66 (2006.01); H01L 29/423 (2006.01); H01L 21/8234 (2006.01); H01L 27/088 (2006.01)
CPC H01L 29/785 (2013.01) [H01L 21/823431 (2013.01); H01L 27/0886 (2013.01); H01L 29/42392 (2013.01); H01L 29/66545 (2013.01); H01L 29/66795 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An integrated circuit device comprising:
a fin shaped active region protruding from a substrate and extending in a first direction;
first, second, and third semiconductor patterns on the fin shaped active region, the first to third semiconductor patterns being spaced apart from each other in a vertical direction;
a gate electrode surrounding the first to third semiconductor patterns and extending in a second direction that is perpendicular to the first direction, the gate electrode comprising:
a main gate portion extending on the third semiconductor pattern in the second direction;
a first sub-gate portion between the fin shaped active region and the first semiconductor pattern;
a second sub-gate portion between the first semiconductor pattern and the second semiconductor pattern; and
a third sub-gate portion between the second semiconductor pattern and the third semiconductor pattern, the third sub-gate portion comprising a sub-gate center portion, and sub-gate edge portions comprising opposing end portions of the third sub-gate portion, respectively, in the second direction;
source/drain regions on opposing sides of the first to third semiconductor patterns, respectively, the source/drain regions being connected to the first to third semiconductor patterns; and
a plurality of inner spacers between side surfaces of the first to third sub-gate portions and the source/drain regions,
wherein, in a horizontal cross-sectional view, a first width of the sub-gate center portion in the first direction is less than a second width of one of the sub-gate edge portions in the first direction, and
wherein a third width of the third sub-gate portion in the first direction is less than a fourth width of the first sub-gate portion in the first direction.