CPC H01L 23/562 (2013.01) [H01L 21/4825 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 21/565 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49541 (2013.01); H01L 23/49551 (2013.01)] | 20 Claims |
1. A method, comprising:
forming a first recess in a first surface of a leadframe, the forming the first recess including defining a die pad with a first dimension in a first direction transverse to the first surface and defining a flange with a second dimension in the first direction greater than the first dimension, the flange being positioned between the first recess and the die pad, and the flange extending from a surface of the die pad;
separating the die pad and the flange from a plurality of leads, the separating including:
forming a second recess in a second surface of the leadframe, the second recess aligned with the first recess and cooperating with the first recess to separate the flange from the plurality of leads, the flange having a first portion coupled to the die pad and a second portion, the second portion having a third surface;
bending the flange toward a center of the die pad after forming the first and second surfaces, the bending including forming a cavity adjacent the first portion of the flange.
|