US 11,699,632 B2
Methods for attachment and devices produced using the methods
Monnir Boureghda, East Stroudsburg, PA (US); Nitin Desai, Princeton Junction, NJ (US); Anna Lifton, Bridgewater, NJ (US); Oscar Khaselev, Monmouth Junction, NJ (US); Michael T. Marczi, Chester, NJ (US); and Bawa Singh, Voorhees, NJ (US)
Assigned to ALPHA ASSEMBLY SOLUTIONS INC., South Plainfield, NJ (US)
Filed by ALPHA ASSEMBLY SOLUTIONS INC., South Plainfield, NJ (US)
Filed on Jan. 20, 2021, as Appl. No. 17/153,706.
Application 17/153,706 is a continuation of application No. 14/027,530, filed on Sep. 16, 2013, granted, now 10,905,041.
Application 14/027,530 is a continuation of application No. 12/175,375, filed on Jul. 17, 2008, granted, now 8,555,491, issued on Oct. 15, 2013.
Claims priority of provisional application 60/950,797, filed on Jul. 19, 2007.
Prior Publication US 2021/0289680 A1, Sep. 16, 2021
Int. Cl. H05K 13/04 (2006.01); H01L 23/373 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/373 (2013.01) [H01L 24/29 (2013.01); H01L 24/32 (2013.01); H01L 24/83 (2013.01); H05K 13/0465 (2013.01); H01L 2224/2936 (2013.01); H01L 2224/29101 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29339 (2013.01); H01L 2224/29344 (2013.01); H01L 2224/29347 (2013.01); H01L 2224/29355 (2013.01); H01L 2224/29364 (2013.01); H01L 2224/29369 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/8384 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/0102 (2013.01); H01L 2924/0103 (2013.01); H01L 2924/014 (2013.01); H01L 2924/0104 (2013.01); H01L 2924/0105 (2013.01); H01L 2924/01006 (2013.01); H01L 2924/01011 (2013.01); H01L 2924/01013 (2013.01); H01L 2924/01019 (2013.01); H01L 2924/01029 (2013.01); H01L 2924/0132 (2013.01); H01L 2924/01033 (2013.01); H01L 2924/01046 (2013.01); H01L 2924/01047 (2013.01); H01L 2924/01077 (2013.01); H01L 2924/01078 (2013.01); H01L 2924/01079 (2013.01); H01L 2924/01082 (2013.01); H01L 2924/10253 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1461 (2013.01); H01L 2924/203 (2013.01); Y10T 29/4913 (2015.01); Y10T 29/49133 (2015.01); Y10T 29/49155 (2015.01); Y10T 428/24893 (2015.01)] 28 Claims
OG exemplary drawing
 
1. A method of attaching a die to a substrate, the method comprising:
disposing a paste comprising a capped nanomaterial on a substrate, wherein the capped nanomaterial comprises metal particles and a capping agent, the capped nanomaterial is dispersed in a solvent prior to disposition, and the solvent is selected from the group consisting of aliphatic alcohols having from 1 to 10 carbon atoms and aromatic compounds having aliphatic side chains that include 2-6 carbon atoms;
disposing a die on the disposed capped nanomaterial; and
sintering the capped nanomaterial at a temperature of 300° C. or less to attach the die to the substrate and form an electrical joint between the substrate and die.