US 11,699,612 B2
Substrate fixing device, electrostatic chuck and electrostatic chuck manufacturing method
Keiichi Takemoto, Nagano (JP); Yoichi Harayama, Nagano (JP); Hiroyuki Asakawa, Nagano (JP); and Takahiro Rokugawa, Nagano (JP)
Assigned to SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed by SHINKO ELECTRIC INDUSTRIES CO., LTD., Nagano (JP)
Filed on Nov. 11, 2021, as Appl. No. 17/524,322.
Claims priority of application No. 2020-189771 (JP), filed on Nov. 13, 2020; and application No. 2021-067843 (JP), filed on Apr. 13, 2021.
Prior Publication US 2022/0157636 A1, May 19, 2022
Int. Cl. H01T 23/00 (2006.01); H01L 21/683 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01L 21/67248 (2013.01); H01L 21/68757 (2013.01)] 11 Claims
OG exemplary drawing
 
1. A substrate fixing device comprising:
a base plate; and
an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force, the electrostatic chuck comprising:
an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate;
a first heating layer that is formed on the adsorption layer and that includes a first electrode configured to generate heat;
a second heating layer that is formed on the first heating layer and that includes a second electrode configured to generate heat; and
a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other:
wherein the via comprises a body portion, and an end portion that is connected to the body portion,
the body portion penetrates at least one of the first electrode and the second electrode,
the end portion is formed on the at least one of the first electrode and the second electrode which the body portion penetrates, and
a diameter of the end portion is larger than that of the body portion.