CPC H01L 21/67126 (2013.01) [B29C 43/18 (2013.01); B29C 43/34 (2013.01); B29C 43/36 (2013.01); B29C 43/52 (2013.01); B29C 43/58 (2013.01); B29C 2043/3405 (2013.01); B29C 2043/5808 (2013.01); B29C 2043/5833 (2013.01); B29L 2031/34 (2013.01)] | 19 Claims |
1. A resin molding apparatus, comprising:
a molding mold that molds a workpiece on which an electronic component is mounted inside a carrier with a resin; and
a loader that transfers the workpiece,
wherein the loader comprises a chuck that comes into contact with and separates from an outer edge part on a lower surface of the workpiece, a moving device that moves the chuck, and a frame that comes into contact with and separates from an outer edge part on an upper surface of the workpiece, and
wherein, at least during transfer, the workpiece is able to be interposed between the chuck and the frame,
the chuck and the fame are provided as a plurality of types of assemblies corresponding to a plurality of types of workpieces having different outer diameters, and
the loader is able to attach/detach and operate the assemblies.
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