US 11,699,546 B2
Coil component
Yong Hui Li, Suwon-si (KR); Byung Soo Kang, Suwon-si (KR); Byeong Cheol Moon, Suwon-si (KR); Ju Hwan Yang, Suwon-si (KR); and Seung Min Lee, Suwon-si (KR)
Assigned to SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed by SAMSUNG ELECTRO-MECHANICS CO., LTD., Suwon-si (KR)
Filed on May 6, 2020, as Appl. No. 16/867,865.
Claims priority of application No. 10-2019-0091563 (KR), filed on Jul. 29, 2019.
Prior Publication US 2021/0035728 A1, Feb. 4, 2021
Int. Cl. H01F 27/28 (2006.01); H01F 27/32 (2006.01); H01F 41/04 (2006.01); H01F 41/12 (2006.01); H01F 27/29 (2006.01)
CPC H01F 27/2804 (2013.01) [H01F 27/29 (2013.01); H01F 27/32 (2013.01); H01F 41/041 (2013.01); H01F 41/12 (2013.01); H01F 2027/2809 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A coil component comprising:
a body;
a supporting substrate embedded in the body;
a coil portion including a coil pattern and a lead-out pattern exposed to an outside of the body through an external surface of the body, the coil portion being disposed on the supporting substrate and embedded in the body; and
an insulating film disposed between the coil portion and the body and spaced apart from the external surface of the body,
wherein at least a portion of the lead-out pattern contacts the body through an opening formed in the insulating film.