CPC G10L 25/51 (2013.01) [G01N 29/14 (2013.01); H04R 1/2876 (2013.01); H04R 7/16 (2013.01); H04R 1/342 (2013.01); H04R 7/04 (2013.01); H04R 19/04 (2013.01); H04R 2201/003 (2013.01)] | 18 Claims |
1. A testing system, comprising:
a testing apparatus comprising a testing stage and an element pickup module for pressing a semiconductor element down on the testing stage; and
a crack noise monitoring device comprising a voiceprint generation unit, a database unit having at least one first voiceprint pattern, a sound conduction set connected to the voiceprint generation unit and the testing apparatus, and a processing unit electrically connected to the voiceprint generating unit and the database unit,
wherein the sound conduction set is configured to transmit a sound wave of the semiconductor element to the voiceprint generation unit after the sound wave is sent to the sound conduction set via the testing apparatus, the sound conduction set comprises a solid conductive vibrator directly connected to the element pickup module, and configured to receive vibration generated from the semiconductor element via the element pickup module; a sound guide tube respectively fixedly connected to the voiceprint generation unit and the solid conductive vibrator; and a diaphragm disposed within the sound guide tube, and configured to convert the vibration into the sound wave and transmit the sound wave to the voiceprint generation unit,
the voiceprint generation unit is configured to receive and convert the sound wave into a second voiceprint pattern, and
the processing unit is configured to compare the at least one first voiceprint pattern and the second voiceprint pattern to determine whether the at least one first voiceprint pattern is identical to the second voiceprint pattern.
|