US 11,699,058 B2
Systems and methods for overmolding a card to prevent chip fraud
Daniel Herrington, New York, NY (US); Stephen Schneider, Midlothian, VA (US); and Tyler Maiman, Melville, NY (US)
Assigned to CAPITAL ONE SERVICES, LLC, McLean, VA (US)
Filed by Capital One Services, LLC, McLean, VA (US)
Filed on Feb. 18, 2022, as Appl. No. 17/675,316.
Application 17/675,316 is a continuation of application No. 17/016,834, filed on Sep. 10, 2020, granted, now 11,288,560.
Application 17/016,834 is a continuation of application No. 16/723,973, filed on Dec. 20, 2019, granted, now 10,810,475, issued on Oct. 20, 2020.
Prior Publication US 2022/0172014 A1, Jun. 2, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G06K 19/073 (2006.01); G06Q 20/34 (2012.01); H01L 23/00 (2006.01)
CPC G06K 19/07309 (2013.01) [G06Q 20/352 (2013.01); H01L 23/573 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A card, comprising:
a substrate including a crimped corner;
a chip pocket formed within the substrate;
a chip at least partially positioned with the chip pocket; and
an overmold including a corner pocket, wherein:
the overmold at least partially encompasses the substrate, and
the corner pocket at least partially encompasses the crimped corner.