US 11,698,970 B2
Double wrapping for verification
Tim Markey, Boise, ID (US); James Ruane, Boise, ID (US); and Robert W. Strong, Boise, ID (US)
Assigned to Micron Technology, Inc., Boise, ID (US)
Filed by Micron Technology, Inc., Boise, ID (US)
Filed on Dec. 28, 2021, as Appl. No. 17/563,409.
Application 17/563,409 is a continuation of application No. 16/731,918, filed on Dec. 31, 2019, granted, now 11,216,562.
Prior Publication US 2022/0198019 A1, Jun. 23, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. G06F 21/57 (2013.01); H04L 9/06 (2006.01); G06F 21/64 (2013.01); H04L 9/32 (2006.01); G06F 21/60 (2013.01)
CPC G06F 21/572 (2013.01) [G06F 21/575 (2013.01); G06F 21/602 (2013.01); G06F 21/64 (2013.01); H04L 9/0643 (2013.01); H04L 9/3249 (2013.01)] 18 Claims
OG exemplary drawing
 
1. A method, comprising:
verifying an integrity of a firmware image signed with a first signature based at least in part on a first signing procedure;
generating, after successfully verifying the integrity of the firmware image signed with the first signature, a second signature for the firmware image based at least in part on a second signing procedure different from the first signing procedure, wherein a first verification time associated with the first signing procedure is different than a second verification time associated with the second signing procedure; and
performing a verification process of the firmware image in response to booting up a memory system to verify the integrity of the firmware image based at least in part on the second signing procedure and the first signing procedure.