US 11,698,581 B2
Method and computing device for manufacturing semiconductor device
Akio Misaka, Hwaseong-si (KR); Changsoo Kim, Hwaseong-si (KR); and Noyoung Chung, Hwaseong-si (KR)
Assigned to Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jun. 28, 2021, as Appl. No. 17/360,365.
Claims priority of application No. 10-2020-0134995 (KR), filed on Oct. 19, 2020.
Prior Publication US 2022/0121107 A1, Apr. 21, 2022
Int. Cl. G03F 1/36 (2012.01); G06F 30/392 (2020.01); G06N 20/00 (2019.01)
CPC G03F 1/36 (2013.01) [G06F 30/392 (2020.01); G06N 20/00 (2019.01)] 19 Claims
OG exemplary drawing
 
1. A non-transitory computer-readable medium storing codes that, when executed by a processor, cause the processor to perform operations of:
receiving full chip data including specific patterns of a first layout;
extracting a representative pattern of the first layout from the full chip data;
generating a vector of the extracted representative pattern;
generating a first data set based on the generated vector;
generating a machine learning model by performing machine learning with respect to the first data set;
executing an optical proximity correction (OPC) with respect to the specific patterns of the first layout by using the machine learning model;
generating a second layout based on a result of executing the OPC; and
causing to generate a mask for manufacturing a semiconductor device based on the second layout.