US 11,698,387 B2
Physical quantity sensor, inertial measurement unit, and method for manufacturing physical quantity sensor
Teruo Takizawa, Matsumoto (JP)
Assigned to SEIKO EPSON CORPORATION
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on Sep. 14, 2021, as Appl. No. 17/474,145.
Claims priority of application No. 2020-154423 (JP), filed on Sep. 15, 2020.
Prior Publication US 2022/0082581 A1, Mar. 17, 2022
Int. Cl. G01P 15/08 (2006.01); G01P 1/02 (2006.01); H01L 21/02 (2006.01)
CPC G01P 15/0802 (2013.01) [G01P 1/023 (2013.01); H01L 21/02 (2013.01); H01L 21/02532 (2013.01); H01L 21/02675 (2013.01); H01L 21/02691 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A method for manufacturing a physical quantity sensor, comprising:
forming a through hole and a recess portion in a lid body, the lid body being formed of a material containing silicon and the recess portion being defined by a plurality of concentric grooves formed in a surface of the lid body that surround the through hole;
configuring a movable body to be accommodated in a space between the lid body and a base body; and
irradiating the material of the lid body that contains the silicon and forms the through hole and the recess portion with laser light to melt the material of the lid body between the plurality of concentric grooves such that the material that forms the lid body and is formed between the plurality of concentric grooves melts and seals the through hole to seal the space,
wherein the surface of the lid body having the plurality of concentric grooves faces away from the space.