US 11,697,873 B2
System and method for vapor deposition coating of extrusion dies using impedance disks
Thomas William Brew, Corning, NY (US); Yuehao Li, Painted Post, NY (US); and Min Shen, Horseheads, NY (US)
Assigned to Corning Incorporated, Corning, NY (US)
Appl. No. 17/414,569
Filed by CORNING INCORPORATED, Corning, NY (US)
PCT Filed Dec. 13, 2019, PCT No. PCT/US2019/066137
§ 371(c)(1), (2) Date Jun. 16, 2021,
PCT Pub. No. WO2020/139580, PCT Pub. Date Jul. 2, 2020.
Claims priority of provisional application 62/785,766, filed on Dec. 28, 2018.
Prior Publication US 2022/0056579 A1, Feb. 24, 2022
Int. Cl. C23C 16/04 (2006.01); C23C 16/34 (2006.01); C23C 16/36 (2006.01); C23C 16/455 (2006.01)
CPC C23C 16/045 (2013.01) [C23C 16/34 (2013.01); C23C 16/36 (2013.01); C23C 16/45502 (2013.01); C23C 16/45565 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A method of depositing an inorganic material on an extrusion die comprising a face comprising a plurality of slots and a plurality of extrusion die pins, the method comprising:
flowing one or more deposition gases into a vapor deposition chamber of a vapor deposition system, such that the gases travel through a plurality of through holes in an impedance disk disposed in the vapor deposition chamber, then the gases travel through the extrusion die disposed in the vapor deposition chamber, and into the plurality of slots to deposit inorganic particles on side walls of the plurality of pins, wherein a total impedance to the flow of the one or more deposition gases across the impedance disk and the extrusion die is equal to a disk impedance of the impedance disk plus a die impedance of the extrusion die, wherein the through holes comprise an average effective diameter, wherein the average effective diameter of the through holes sets the disk impedance to be at least 40% of the total impedance to the flow of the one or more deposition gases across the impedance disk and the extrusion die, and wherein the disk impedance is at least 40% of the total impedance to the flow of the one or more deposition gases.