CPC C09K 5/14 (2013.01) [C08K 3/042 (2017.05); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 3/34 (2013.01); C08K 3/38 (2013.01); C08K 7/04 (2013.01); C08K 9/02 (2013.01); H01L 23/3737 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/282 (2013.01); C08K 2003/385 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/016 (2013.01); G03F 7/322 (2013.01)] | 19 Claims |
1. A thermal conductive layer comprising:
at least one filler,
wherein the thermal conductive layer has a thermal diffusivity of 5.0×10−7 m2s−1 or more and a volume resistivity of 1.0×1011 Ω·cm or more,
wherein the thermal conductive layer is formed of a photosensitive layer comprising the at least one filler and a photosensitive material,
wherein a content of the at least one filler of the photosensitive layer is 70% by mass or less with respect to the total mass of the photosensitive layer,
wherein the filler has an aspect ratio of 5 or more,
wherein a content of the at least one filler of the photosensitive layer is 20% to 60% by volume with respect to the total volume of the photosensitive layer.
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