CPC B81B 7/0048 (2013.01) [B81C 1/00325 (2013.01); G01L 9/0072 (2013.01); B81B 2201/0264 (2013.01); B81B 2201/0271 (2013.01); B81B 2203/0127 (2013.01); B81B 2203/04 (2013.01); B81C 2201/0132 (2013.01)] | 7 Claims |
1. An arrangement comprising:
a microelectromechanical, MEMS, structure including at least one active element, the MEMS structure comprising a substrate, at least one layer formed on the substrate forming at least part of the at least one active element, mechanical contact areas through which the MEMS structure is connectable to other structures, and trench weakenings included around the mechanical contact areas for eliminating thermal mismatch between the at least one active element of the MEMS structure and the other structures, and
an integrated circuit distinct from the MEMS structure, wherein
the MEMS structure comprises an encapsulation, the MEMS structure being assembled directly on the integrated circuit, the integrated circuit forming part of the encapsulation,
wherein the integrated circuit comprises a substrate of a semiconductor material.
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