US 11,697,382 B2
Vehicular vision system with forward viewing camera module
Garret F. Achenbach, Rochester Hills, MI (US); Brian A. Gorman, Burton, MI (US); Brian F. Smith, Macomb, MI (US); and Steven G. Gebauer, Oxford, MI (US)
Assigned to MAGNA ELECTRONICS INC., Auburn Hills, MI (US)
Filed by MAGNA ELECTRONICS INC., Auburn Hills, MI (US)
Filed on Jul. 18, 2022, as Appl. No. 17/813,050.
Application 17/813,050 is a continuation of application No. 17/249,703, filed on Mar. 10, 2021, granted, now 11,390,223.
Application 17/249,703 is a continuation of application No. 16/806,100, filed on Mar. 2, 2020, granted, now 10,946,813, issued on Mar. 16, 2021.
Application 16/806,100 is a continuation of application No. 16/283,920, filed on Feb. 25, 2019, granted, now 10,576,908, issued on Mar. 3, 2020.
Application 16/283,920 is a continuation of application No. 15/899,131, filed on Feb. 19, 2018, granted, now 10,214,157, issued on Feb. 26, 2019.
Application 15/899,131 is a continuation of application No. 14/705,076, filed on May 6, 2015, granted, now 9,896,039, issued on Feb. 20, 2018.
Claims priority of provisional application 61/990,927, filed on May 9, 2014.
Prior Publication US 2022/0355745 A1, Nov. 10, 2022
This patent is subject to a terminal disclaimer.
Int. Cl. B60R 11/04 (2006.01); H05K 7/20 (2006.01); B60R 1/00 (2022.01); H04N 7/18 (2006.01); H04N 23/57 (2023.01)
CPC B60R 11/04 (2013.01) [B60R 1/00 (2013.01); H04N 7/181 (2013.01); H04N 23/57 (2023.01); H05K 7/2039 (2013.01)] 44 Claims
OG exemplary drawing
 
1. A vehicular vision system, the vehicular vision system comprising:
a camera module configured for mounting at an in-cabin side of a windshield of a vehicle equipped with said vehicular vision system;
wherein said camera module comprises a camera housing having an upper housing portion and a lower housing portion;
wherein said camera housing, with said upper housing portion connected to said lower housing portion, houses at least (i) electronic circuitry disposed at a main printed circuit board (main PCB) and (ii) an imager assembly;
wherein said imager assembly comprises a lens holder, said lens holder comprising an elongated lens barrel that houses at least one lens;
wherein, as accommodated at said camera module, said elongated lens barrel of said lens holder is at an acute angle α relative to said main PCB;
wherein said imager assembly comprises an imager printed circuit board (imager PCB);
wherein said imager PCB comprises a front side and a rear side that is spaced from said front side by a thickness dimension of said imager PCB;
wherein electronic circuitry of said imager PCB of said imager assembly comprises a CMOS imaging array sensor, and wherein said CMOS imaging array sensor is disposed at said front side of said imager PCB;
wherein said CMOS imaging array sensor comprises a two-dimensional array of rows and columns of photosensing elements and comprises at least one million photosensing elements;
wherein said main PCB has an upper side and a lower side that is spaced from said upper side by a thickness dimension of said main PCB;
wherein image data captured by said CMOS imaging array sensor is conveyed via a flexible cable from said imager PCB to electronic circuitry disposed at said main PCB;
wherein said lower side of said main PCB faces said lower housing portion and said upper side of said main PCB faces said upper housing portion;
wherein the electronic circuitry of said main PCB is disposed at said upper side of said main PCB and at said lower side of said main PCB;
wherein an electronic component of the electronic circuitry disposed at said main PCB is in thermal conductivity with a thermal element;
wherein said thermal element is in thermal conductivity with said lower housing portion of said camera housing and, during operation of said camera module, enhances heat transfer from the electronic component of the electronic circuitry disposed at said main PCB to said lower housing portion of said camera housing;
wherein said camera housing is configured for mounting said camera module at a bracket attached at the in-cabin side of the windshield of the equipped vehicle, and wherein, with said camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, said CMOS imaging array sensor views forward of the equipped vehicle through the windshield; and
wherein, with said camera module mounted at the bracket attached at the in-cabin side of the windshield of the equipped vehicle, said camera module may be detached for replacement or service with the bracket remaining attached at the windshield.