US 11,697,235 B2
Injection molding apparatus
Daichi Miyashita, Matsumoto (JP)
Assigned to SEIKO EPSON CORPORATION
Filed by Seiko Epson Corporation, Tokyo (JP)
Filed on Jul. 20, 2021, as Appl. No. 17/380,122.
Claims priority of application No. 2020-124311 (JP), filed on Jul. 21, 2020.
Prior Publication US 2022/0024091 A1, Jan. 27, 2022
Int. Cl. B29C 45/04 (2006.01); B29C 45/17 (2006.01); B29C 45/73 (2006.01)
CPC B29C 45/1742 (2013.01) [B29C 45/04 (2013.01); B29C 45/7312 (2013.01); B29K 2905/00 (2013.01)] 6 Claims
OG exemplary drawing
 
1. An injection molding apparatus, comprising:
a first mounting block on which a fixed mold is mounted;
a second mounting block on which a movable mold facing the fixed mold is mounted the second mounting block having a first through hole through which a first diver is inserted,
a linear bush provided at an inner surface of the first through hole of the second mounting block, the linear bush being configured to move the second mounting block back and forth with respect to the first mounting block along the first diver;
a heat conduction prevention portion disposed in the second mounting block between the movable mold and the linear bush in a state where the movable mold is mounted on the second mounting block, the heat conduction prevention portion extending along a longitudinal direction of the linear bush; and
an injection unit configured to inject a molten material into a cavity formed by the fixed mold and the movable mold to form a molded product,
wherein the heat conduction prevention portion is configured to prevent heat conduction from the moveable mold to the linear bush while forming the molded product.