US 11,697,183 B2
Fabrication of a polishing pad for chemical mechanical polishing
An-Hsuan Lee, Hsinchu (TW); Ming-Shiuan She, Taoyuan (TW); Chen-Hao Wu, Taichung (TW); Chun-Hung Liao, Taichung (TW); Shen-Nan Lee, Hsinchu County (TW); and Teng-Chun Tsai, Hsinchu (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu (TW)
Filed on Jun. 27, 2019, as Appl. No. 16/454,402.
Claims priority of provisional application 62/703,774, filed on Jul. 26, 2018.
Prior Publication US 2020/0030934 A1, Jan. 30, 2020
Int. Cl. C08J 9/26 (2006.01); B24B 37/24 (2012.01); B32B 3/10 (2006.01); B32B 3/12 (2006.01); C09G 1/02 (2006.01); B24B 37/10 (2012.01); C08L 81/06 (2006.01); C08L 75/04 (2006.01); C08L 77/00 (2006.01); C08L 53/00 (2006.01); B32B 5/00 (2006.01)
CPC B24B 37/24 (2013.01) [B24B 37/107 (2013.01); B32B 3/10 (2013.01); B32B 3/12 (2013.01); C08J 9/26 (2013.01); C09G 1/02 (2013.01); B32B 5/00 (2013.01); C08L 53/00 (2013.01); C08L 75/04 (2013.01); C08L 77/00 (2013.01); C08L 81/06 (2013.01)] 20 Claims
 
1. A method of forming a chemical-mechanical polishing (CMP) pad, comprising:
forming a CMP top pad; and
combining the CMP top pad and a CMP sub-pad to form the CMP pad,
wherein the CMP top pad is configured to engage with a workpiece during a CMP process, and forming the CMP top pad comprises:
providing a solution of a block copolymer (BCP) on a support substrate, wherein the BCP includes a first segment and a second segment connected to the first segment, the second segment being different from the first segment in composition;
processing the BCP solution to form a polymer network having a first phase and a second phase embedded in the first phase, wherein the first phase includes the first segment and the second phase includes the second segment;
removing the second phase from the polymer network, thereby forming a polymer film that includes a network of pores embedded in the first phase; and
removing the polymer film from the support substrate.
 
10. The method of claim 1,
wherein forming the CMP top pad further comprises removing a topmost portion and a bottommost portion of the polymer film; and
combining the CMP top pad and the CMP sup-pad comprises bonding the CMP top pad to the CMP sub-pad with an adhesive.