CPC B23P 15/34 (2013.01) [B23K 11/30 (2013.01); B23K 35/0211 (2013.01); B23K 35/228 (2013.01); B23K 35/302 (2013.01); B23K 35/3601 (2013.01); B23K 2101/20 (2018.08); B23K 2101/35 (2018.08); B23K 2103/12 (2018.08); B23K 2103/30 (2018.08); B23K 2103/50 (2018.08)] | 20 Claims |
1. A method of overlaying a downhole tool for engagement downhole, the method comprising:
molding a clay in a wet state into a structure, the clay in the wet state being a workable combination comprising a first grain, a second grain, and a binder, the first grain comprising a metal alloy having a first hardness and a first melting point, the second grain comprising a second material, the second material having a second hardness greater than the first hardness of the metal alloy and having a second melting point higher than of the first melting point of the metal alloy, the binder binding the first and second grains into the workable combination and having a combustion temperature at least not greater than the first melting point; and
affixing the structure to the downhole tool by:
positioning the structure in a fusible state adjacent the downhole tool;
applying a heat treatment to the structure at least up to the first melting point;
fusing the structure together with the applied heat treatment; and
forming a metallurgical bond between the structure with the downhole tool with the applied heat treatment.
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