US 11,697,169 B2
Soldering device and control method for soldering device
Hisaki Hayashi, Kobe (JP); Yasuyuki Watanabe, Kobe (JP); and Noboru Hashimoto, Toyama (JP)
Assigned to DENSO TEN Limited, Kobe (JP); and SENJU SYSTEM TECHNOLOGY CO., LTD., Toyama (JP)
Filed by DENSO TEN Limited, Kobe (JP); and Senju System Technology Co., Ltd., Toyama (JP)
Filed on Jun. 18, 2020, as Appl. No. 16/904,918.
Claims priority of application No. 2019-113901 (JP), filed on Jun. 19, 2019.
Prior Publication US 2020/0398359 A1, Dec. 24, 2020
Int. Cl. B23K 3/06 (2006.01); B23K 3/08 (2006.01); G05B 15/02 (2006.01)
CPC B23K 3/0653 (2013.01) [B23K 3/08 (2013.01); G05B 15/02 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A soldering device, comprising:
a jet nozzle that jets a molten solder;
a cover that is filled with an inert gas in an inside thereof and has a hole part at a position that corresponds to the jet nozzle; and
a pressing part that presses the cover, wherein:
the cover causes the jet nozzle to protrude from the hole part for an application time period when the solder is applied to an application target and houses the jet nozzle in the inside of the cover for a waiting time period other than the application time period;
for the application time period, (i) the cover contacts a conveyance body that houses the application target in an inside thereof and (ii) the inside of the conveyance body and the inside of the cover are joined so that the inert gas that fills the inside of the cover flows into the inside of the conveyance body and thereby the application target that is housed in the inside of the conveyance body is surrounded by the inert gas that fills the inside of the conveyance body; and
during a time in the application time period in which the cover is moved by pressure of the conveyance body, the pressing part presses the cover against the conveyance body.