US RE50,485 E1
Semiconductor module with external power sensor
Juergen Hoegerl, Regensburg (DE); Leo Aichriedler, Puch (AT); Christian Schweikert, Munich (DE); and Gerald Wriessnegger, Villach (AT)
Assigned to Infineon Technologies AG, Neubiberg (DE)
Filed by Infineon Technologies AG, Neubiberg (DE)
Filed on Mar. 25, 2022, as Appl. No. 17/704,811.
Application 17/704,811 is a reissue of application No. 16/260,405, filed on Jan. 29, 2019, granted, now 10,699,976, issued on Jun. 30, 2020.
Int. Cl. H01L 23/31 (2006.01); G01R 15/20 (2006.01); G01R 33/00 (2006.01); G01R 33/07 (2006.01); G01R 33/09 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 21/66 (2006.01); H01L 23/051 (2006.01); H01L 23/057 (2006.01); H01L 23/367 (2006.01); H01L 23/373 (2006.01); H01L 23/44 (2006.01); H01L 23/473 (2006.01); H01L 23/50 (2006.01); H01L 25/00 (2006.01); H01L 25/07 (2006.01); H01L 25/16 (2023.01); H10N 50/10 (2023.01); H10N 52/00 (2023.01)
CPC H01L 23/3121 (2013.01) [G01R 15/207 (2013.01); G01R 33/072 (2013.01); G01R 33/091 (2013.01); H01L 21/4817 (2013.01); H01L 21/4871 (2013.01); H01L 21/565 (2013.01); H01L 22/34 (2013.01); H01L 23/057 (2013.01); H01L 23/3675 (2013.01); H01L 23/3735 (2013.01); H01L 23/44 (2013.01); H01L 23/473 (2013.01); H01L 23/50 (2013.01); H01L 25/072 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H10N 50/10 (2023.02); H10N 52/00 (2023.02); G01R 33/0005 (2013.01); G01R 33/0017 (2013.01); H01L 23/051 (2013.01)] 32 Claims
OG exemplary drawing
 
[ 22. A semiconductor module, comprising:
a semiconductor die;
a mold compound encasing the semiconductor die;
a plurality of terminals electrically connected to the semiconductor die and protruding out of the mold compound, a first one of the terminals haVing a constricted region covered by the mold compound; and
a recess formed in an exterior surface of the mold compound,
wherein the recess is aligned with the constricted region of the first terminal,
wherein the recess is shaped to receive a coreless magnetic field sensor,
wherein the mold compound isolates the constricted region of the first terminal from the recess. ]