US D1,082,783 S
Assembled electronics housing
James Christian Albrechtsen, Morphett Vale (AU); Seth Michael Brady, Hindmarsh (AU); and Peter William Cosgriff, Morphett Vale (AU)
Assigned to Redarc Technologies Pty Ltd., (AU)
Filed by REDARC TECHNOLOGIES PTY LTD, Morphett Vale (AU)
Filed on Feb. 25, 2022, as Appl. No. 29/828,399.
Claims priority of application No. 202115047 (AU), filed on Aug. 25, 2021.
Term of patent 15 Years
LOC (15) Cl. 14 - 02
U.S. Cl. D14—356
OG exemplary drawing
 
The ornamental design for an assembled electronics housing, as shown and described.