US 12,356,872 B2
Heat shield and Josephson junction array chip system
Qifeng Huang, Jiangsu (CN); Qing Xu, Jiangsu (CN); Siyun Wang, Jiangsu (CN); Zhixin Li, Jiangsu (CN); Xiao Chen, Jiangsu (CN); Zhongdong Wang, Jiangsu (CN); Mingming Chen, Jiangsu (CN); Yongxian Yi, Jiangsu (CN); Guofang Xia, Jiangsu (CN); and Jin Bao, Jiangsu (CN)
Assigned to State Grid Jiangsu Electric Power Co., Ltd. Marketing Center, Nanjing (CN)
Filed by STATE GRID JIANGSU ELECTRIC POWER CO., LTD. MARKETING CENTER, Jiangsu (CN)
Filed on Nov. 21, 2024, as Appl. No. 18/955,851.
Application 18/955,851 is a continuation of application No. PCT/CN2024/119913, filed on Sep. 20, 2024.
Claims priority of application No. 202311315251.4 (CN), filed on Oct. 12, 2023.
Prior Publication US 2025/0127066 A1, Apr. 17, 2025
Int. Cl. H10N 60/00 (2023.01); H10N 60/12 (2023.01); H10N 69/00 (2023.01)
CPC H10N 69/00 (2023.02) [H10N 60/12 (2023.02)] 18 Claims
OG exemplary drawing
 
1. A heat shield, comprising a cryostat, a sensor group, a radiation shield plate, a waveguide assembly, a clamp assembly, and a vacuum shield cover assembly; wherein
the cryostat comprises a cold head, a first-stage chassis, and a second-stage chassis that are arranged at intervals in sequence;
the vacuum shield cover assembly comprises a first vacuum shield cover and a second vacuum shield cover; the second vacuum shield cover is fixed to the second-stage chassis, the first vacuum shield cover is fixed to the first-stage chassis and is located in the second vacuum shield cover, and the cold head is located in the first vacuum shield cover; the vacuum shield cover assembly further comprises a heat shield aluminum oxide layer, and the heat shield aluminum oxide layer is coated on at least one of a surface of the first vacuum shield cover or a surface of the second vacuum shield cover;
the radiation shield plate is fixed on the cold head;
the waveguide assembly is configured to be connected to an antenna of a Josephson junction array chip, the waveguide assembly comprises a rigid waveguide and a flexible waveguide connected to the rigid waveguide, the rigid waveguide is located in the first vacuum shield cover, and the flexible waveguide extends outside the second vacuum shield cover;
the clamp assembly is arranged on the radiation shield plate and is configured to fix the Josephson junction array chip; and
the sensor group is arranged on the radiation shield plate and is configured to be adjacent to the Josephson junction array chip.