US 12,356,864 B2
Acoustic isolator
Peter Smeys, San Jose, CA (US); Mohammad Hadi Motieian Najar, Santa Clara, CA (US); Ting-Ta Yen, San Jose, CA (US); and Ahmad Bahai, Lafayette, CA (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Dec. 27, 2018, as Appl. No. 16/233,350.
Claims priority of provisional application 62/620,825, filed on Jan. 23, 2018.
Prior Publication US 2019/0229254 A1, Jul. 25, 2019
Int. Cl. H10N 30/88 (2023.01); H04R 1/40 (2006.01); H04R 17/00 (2006.01); H04R 17/02 (2006.01); H04R 31/00 (2006.01); H10N 30/20 (2023.01); H10N 30/30 (2023.01); H10N 30/85 (2023.01); H10N 30/87 (2023.01); H10N 39/00 (2023.01)
CPC H10N 30/883 (2023.02) [H04R 1/403 (2013.01); H04R 17/00 (2013.01); H10N 30/20 (2023.02); H10N 30/30 (2023.02); H10N 30/872 (2023.02); H10N 39/00 (2023.02); H04R 17/02 (2013.01); H04R 31/00 (2013.01); H10N 30/85 (2023.02); H10N 30/877 (2023.02)] 17 Claims
OG exemplary drawing
 
1. An apparatus, comprising:
a lead frame;
a semiconductor substrate on the lead frame;
a first layer on the semiconductor substrate, the first layer including a first acoustic transducer and a first electrical contact coupled to the first acoustic transducer;
an acoustic medium on the first layer, in which a portion of the first layer including the first acoustic transducer is between the acoustic medium and the semiconductor substrate;
a second layer on the acoustic medium, in which at least part of the acoustic medium is between the first and second layers, and the second layer includes a second acoustic transducer and a second electrical contact coupled to the second acoustic transducer;
a first contact pad coupled to the first electrical contact;
a second contact pad coupled to the second electrical contact; and
a mold compound encapsulating at least a respective part of each the lead frame, the semiconductor substrate, the acoustic medium, the first and second layers, the first and second electrical contacts, and the first and second contact pads.