US 12,356,811 B2
Display device and electronic device with heat absorption layer coupled to pad electrode layer
Kiwamu Miura, Kanagawa (JP)
Assigned to Sony Semiconductor Solutions Corporation, Kanagawa (JP)
Appl. No. 17/428,413
Filed by Sony Semiconductor Solutions Corporation, Kanagawa (JP)
PCT Filed Mar. 4, 2020, PCT No. PCT/JP2020/009132
§ 371(c)(1), (2) Date Aug. 4, 2021,
PCT Pub. No. WO2020/184329, PCT Pub. Date Sep. 17, 2020.
Claims priority of application No. 2019-044656 (JP), filed on Mar. 12, 2019.
Prior Publication US 2022/0130914 A1, Apr. 28, 2022
Int. Cl. H10K 59/131 (2023.01); H10K 50/87 (2023.01); H10K 59/121 (2023.01); H10K 59/80 (2023.01)
CPC H10K 59/131 (2023.02) [H10K 50/87 (2023.02); H10K 59/121 (2023.02); H10K 59/8794 (2023.02)] 4 Claims
OG exemplary drawing
 
1. A display device comprising:
a pixel array portion in which pixels each including a light emitting portion are arranged in rows and columns in a plan view;
a pad electrode layer on which another light emitting portion is formed, the pad electrode layer being arranged on a substrate outside the pixel array portion in the plan view; and
a heat absorption layer thermally coupled to the pad electrode layer, wherein
the heat absorption layer is configured to increase a heat capacity of the pad electrode layer,
the heat absorption layer includes a wiring layer formed as a layer below the pad electrode layer, and
the heat absorption layer is provided over an entirety of each of pads of the pad electrode layer in a length direction.