US 12,356,785 B2
Mechanically strong connections for perovskite-silicon tandem solar cells
Todd Krajewski, Mountain View, CA (US); and Tomas Leijtens, Redwood City, CA (US)
Assigned to Swift Solar Inc., San Carlos, CA (US)
Filed by Swift Solar Inc., San Carlos, CA (US)
Filed on Aug. 31, 2023, as Appl. No. 18/459,154.
Application 18/459,154 is a continuation of application No. 18/458,959, filed on Aug. 30, 2023.
Prior Publication US 2025/0081710 A1, Mar. 6, 2025
Int. Cl. H10K 39/18 (2023.01); H10K 30/57 (2023.01); H10K 30/89 (2023.01); H10K 39/00 (2023.01); H10K 39/12 (2023.01); H10K 39/15 (2023.01); H10K 71/20 (2023.01); H10K 71/60 (2023.01); H10K 85/50 (2023.01)
CPC H10K 39/18 (2023.02) [H10K 30/57 (2023.02); H10K 30/89 (2023.02); H10K 39/12 (2023.02); H10K 39/15 (2023.02); H10K 39/601 (2023.02); H10K 71/20 (2023.02); H10K 71/60 (2023.02); H10K 85/50 (2023.02)] 13 Claims
OG exemplary drawing
 
1. A solar cell module comprising:
a first tandem solar cell including:
a first lower silicon subcell;
a first upper perovskite subcell;
a conductive recombination layer between the first lower silicon subcell and the first upper perovskite subcell;
a junction layer of first conductivity type spanning over a top side of the first tandem solar cell and directly on a portion of the first lower silicon subcell, wherein a diode is formed at an interface of the junction layer and the first lower silicon subcell;
a first step surface including a first step edge adjacent to the first upper perovskite subcell and a step floor over the junction layer where the junction layer is directly on the first lower silicon subcell; and
a first electrically conductive support adjacent to the first step edge and at least partially filling the first step surface; and
a second tandem solar cell including:
a second lower silicon subcell; and
a second upper perovskite subcell;
wherein a back side of the second tandem solar cell is bonded to the top side of the first tandem solar cell with an electrically conductive bonding material, the electrically conductive bonding material positioned substantially over the first electrically conductive support.