US 12,356,780 B2
Display device and manufacturing method thereof
Shiuan-Tzung Cheng, Hsinchu (TW); Ching-Yao Shih, Hsinchu (TW); and Cheng-Liang Wang, Hsinchu (TW)
Assigned to Au Optonics Corporation, Hsinchu (TW)
Filed by Au Optronics Corporation, Hsinchu (TW)
Filed on Nov. 4, 2021, as Appl. No. 17/519,557.
Claims priority of application No. 110131353 (TW), filed on Aug. 24, 2021.
Prior Publication US 2023/0064954 A1, Mar. 2, 2023
Int. Cl. H10H 29/14 (2025.01); H10H 20/01 (2025.01); H10H 20/841 (2025.01); H10H 20/851 (2025.01); H10H 20/857 (2025.01)
CPC H10H 29/142 (2025.01) [H10H 20/01 (2025.01); H10H 20/841 (2025.01); H10H 20/851 (2025.01); H10H 20/857 (2025.01); H10H 20/034 (2025.01); H10H 20/0361 (2025.01); H10H 20/0364 (2025.01)] 20 Claims
OG exemplary drawing
 
1. A display device, comprising:
a circuit substrate;
a silicon dioxide pattern, located on the circuit substrate, having first openings;
light-emitting elements, located on the circuit substrate, electrically connected to the circuit substrate, wherein the light-emitting elements are located in the first openings respectively and are adjacent to the silicon dioxide pattern; and
a release layer, attached to the light-emitting elements and used to facilitate removal of a growth substrate for forming the light-emitting elements, wherein the silicon dioxide pattern and the light-emitting elements are located between the circuit substrate and the release layer, and no intervening element exists between the silicon dioxide pattern and the circuit substrate.