US 12,356,777 B2
Semiconductor devices and methods of manufacturing semiconductor devices
Ki Dong Sim, Gyeonggi-do (KR); Dong Joo Park, Incheon (KR); and Jin Young Khim, Seoul (KR)
Assigned to Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed by Amkor Technology Singapore Holding Pte. Ltd., Singapore (SG)
Filed on Dec. 20, 2022, as Appl. No. 18/085,044.
Application 18/085,044 is a division of application No. 16/875,816, filed on May 15, 2020, granted, now 11,545,604.
Prior Publication US 2023/0117746 A1, Apr. 20, 2023
Int. Cl. H10H 20/855 (2025.01); H10F 71/00 (2025.01); H10F 77/00 (2025.01); H10F 77/40 (2025.01); H10F 77/50 (2025.01); H10H 20/85 (2025.01); H10H 20/857 (2025.01); H10H 20/01 (2025.01)
CPC H10H 20/855 (2025.01) [H10F 71/00 (2025.01); H10F 77/407 (2025.01); H10F 77/50 (2025.01); H10F 77/93 (2025.01); H10H 20/8506 (2025.01); H10H 20/857 (2025.01); H10H 20/0363 (2025.01); H10H 20/0364 (2025.01)] 10 Claims
OG exemplary drawing
 
1. A method to manufacture a semiconductor device, comprising:
providing a first lens substrate comprising a first lens dielectric and having a first lens;
providing a first spacer substrate facing the first lens substrate, wherein the first spacer substrate comprises spacer cavity at a central portion of the first spacer substrate;
coupling the first lens substrate and the first spacer substrate with a first interconnect, wherein the first interconnect is between a top side of the first lens substrate and a bottom side of the first spacer substrate;
wherein:
the first lens substrate comprises a first lens via, and a first lens terminal coupled to the first lens via;
the first spacer substrate comprises a first spacer via, and a first spacer terminal coupled to the first spacer via; and
the first interconnect couples the first lens terminal with the first spacer terminal;
providing a base unit comprising a base unit dielectric structure, a base unit encapsulant over the base unit encapsulant, and an electronic component in the base unit encapsulant and external to the first lens substrate, wherein the base unit is spaced apart from the first lens substrate;
coupling the base unit and the first lens substrate with a base interconnect between the base unit encapsulant and the first lens substrate;
providing a device encapsulant covering a lateral side of the first lens substrate and covering an exterior lateral dielectric wall of the first spacer substrate;
providing a first underfill between the first lens substrate and the first spacer substrate, wherein the first underfill covers the first interconnect, wherein the first underfill is exterior to the first lens substrate; and
providing a second underfill between the base unit encapsulant and the first lens substrate, wherein the second underfill covers the base interconnect, wherein the second underfill is exterior to the base unit encapsulant;
wherein the base interconnect is external to the base unit and external to the first lens substrate;
wherein the coupling with the base interconnect aligns the electronic component with the first lens; and
wherein the first lens and the first lens dielectric comprise a same material.