US 12,356,771 B2
Light-emitting device and display device
Yukitoshi Marutani, Anan (JP)
Assigned to NICHIA CORPORATION, Anan (JP)
Filed by NICHIA CORPORATION, Anan (JP)
Filed on Jun. 3, 2022, as Appl. No. 17/832,304.
Application 17/832,304 is a continuation of application No. 16/723,857, filed on Dec. 20, 2019, granted, now 11,387,392.
Claims priority of application No. 2018-240457 (JP), filed on Dec. 25, 2018; and application No. 2019-229616 (JP), filed on Dec. 19, 2019.
Prior Publication US 2022/0302356 A1, Sep. 22, 2022
Int. Cl. H10H 20/857 (2025.01); H10H 20/851 (2025.01); H10H 20/854 (2025.01); H10H 29/14 (2025.01)
CPC H10H 20/8512 (2025.01) [H10H 20/854 (2025.01); H10H 29/14 (2025.01)] 14 Claims
OG exemplary drawing
 
1. A display device comprising:
a mounting substrate;
a plurality of light-emitting devices arranged on the mounting substrate; and
a single crystal substrate having a plurality of openings;
wherein the mounting substrate comprises:
a plurality of thin-film transistor (TFT) elements, and
a plurality of conductive pads, each of which is electrically connected to one of the plurality of TFT elements;
wherein each of the plurality of light-emitting devices comprises:
a semiconductor stacked body located below one of the openings,
a first metallic section electrically connected to the semiconductor stacked body,
a second metallic section electrically connected to the semiconductor stacked body,
a first conductive layer comprising a semiconductor connecting section located between an outermost lateral surface of the semiconductor stacked body and a lateral surface of the first metallic section that faces the outermost lateral surface of the semiconductor stacked body, and
a second conductive layer comprising an extended section located between the outermost lateral surface of the semiconductor stacked body and a lateral surface of the second metallic section that faces the outermost lateral surface of the semiconductor stacked body;
wherein each of the semiconductor stacked bodies is disposed between a respective one of the first metallic sections and a respective one of the second metallic sections, and the plurality of conductive pads include:
a plurality of first conductive pads, each electrically connected to the first metallic section of a respective one of the light-emitting devices, and
a plurality of second conductive pads, each electrically connected to the second metallic section of the respective one of the light-emitting devices; and
wherein the TFT elements are disposed in regions other than underneath the first metallic sections and the second metallic sections.